Polyimide Varnish

PI Varnish (Thermosetting Polyimide)

• Electrical insulation and heat resistance are excellent.
• Continuous operating temperature is 350 ℃, and the instantaneous and can withstand temperatures above 400 ℃.
• Excellent mechanical properties and long-term heat resistance.
• Insoluble in all organic solvents and acids, alkaline chemicals are resistant.
• Semiconductor, LCD alignment layer, FPC will be applied to

Features

• Electrical insulation and heat resistance are excellent.
• Continuous operating temperature is 350 ℃, and the instantaneous and can withstand temperatures above 400 ℃.
• solid content : 5 ~ 20wt%
• viscosity : 10cps ~ 12000cps

Specification : package

Description

• PI Varnish (Polyimide varnish ; ThermoPlastic Polyimide)
• Its mechanical feature, electric insulating property and heat resisting property are great.
• Continuous exhaust temperature is 350℃, momentary temperature is over 400℃.
• It cannot be used for all kinds of organic solvents and it has resistance against the chemicals such as acid or alkali.

Primary varnish Features

• Solvent (NMP)
• Solid Concentration (15 .0 ± 5wt%)
• Viscosity (3,000 ± 600 Cps)
• Density (1.1 ± 0.01g/ml)

Primary Features after film cure

• Superior heat-resistant, Humidity-resistance
• Dimensional stability ight
• Designed for the requests of light weight
• Excellent flexible endurance
• Good flame retardant and chemical resistance

Application

• Electronic material : FCCL, Covering materials, Package PCB
• Semiconductor materials : Buffer coat, LSI, Passivation
• Optics cable, Vacuum equipment, IC test socket, etc.