TPI_Polyzen 250T

TPI Varnish (ThermoPlastic Polyimide)

Description

• PI Varnish (ThermoPlastic Polyimide)
• Its mechanical feature, electric insulating property and heat resisting property are great.
• Continuous exhaust temperature is 350℃, momentary temperature is over 400℃.
• It cannot be used for all kinds of organic solvents and it has resistance against the chemicals such as acid or alkali.

Primary varnish Features

• Solvent (NMP, DMAC)
• Solid concentration (15.0 ± 5wt%)
• Viscosity (3,000 ± 1,000Cps)
• Density (1.14 ± 0.01g/ml)

Primary Features after film cure

• Excellent punching property
• Good adhesion, uniform and good wetting property
• Excellent reliability
• Low out-ags / Low ionic impurities / Low wetting property
• Long and stable storage at room temperature

Application

• Electronic material : FCCL, Covering materials, Package PCB
• Semiconductor materials : Buffer coat, LSI, Passivation
• Optics cable, Vacuum equipment, IC test socket, etc.